LIGA加工及喷气式Z箍缩脉冲等离子体软X射线源

LIGA Process and Gas-Puff Z-Pinch Pulsed Plasma X─Ray Source

ＬＩＧＡ加工中关键技术之一是深度Ｘ射线光刻，它需要性能优越的Ｘ射线源，现在普遍使用的是同步辐射加速器，但其造价十分昂贵，运行也十分复杂。本文试图利用结构简单、运行方便、效率较高和造价很低的喷气式Ｚ箍缩脉冲等离子体软Ｘ射线源，进行ＬＩＧＡ加工的探讨，由于此Ｘ射线源为点源而非平行光，而且强度也相对较小，所以本文对点源Ｘ射线在曝光中的影响作了估计，同时对一定深度光刻所需放电次数进行了计算。结果表明：当Ｘ射线源离掩膜距离合适、抗蚀剂灵敏度较高时，进行几十微米深的光刻是可能的。

Abstract One of key techniques in LIGA process is X-ray deep-etch Lithography,so it is necessary to develop high quality X-ray source.At present time,the widely used X-ray source in LIGA process is sychrotron radiation,however it is very expensive to con-struct a sychrotron radiation device and complicated to operate it.So in the paper,we try todo some research work about LIGA process by means of gas-puff Z-pinch pulsed plasma X-ray source with simple structure,high efficience and low cost.The effect on lithographydue to point X-ray source has been estimated and calculation of discharges needed for cer-tain lithographic depth has also been carried out.The results shows that it is possible to fab-ricate a depth of 50～100μm when X-ray source is at suitable location from the resist andmore sensitive resists are selected.