喷蒸热压生产酚醛树脂胶大片刨花板

Production of Liquid Phenol-Formaldehyde Adhesive Waferboards with Steam-Injection Pressing

该文采用低压蒸汽喷蒸热压来生产液体酚醛树脂胶大片刨花板.热压温度为180℃,所喷蒸汽的压力为0.3～0.5MPa.经不同的喷汽时间、热压时间生产出刨花板,分别测定试件的静曲强度、内结合强度、吸水厚度膨胀率、吸水率,以探索喷汽时间、热压时间对板材性能的影响.结论为;喷蒸热压相对于传统热压,在缩短热压时间方面有一定的优势,但程度不够明显;所喷蒸汽的温度和压力有待进一步提高.

This research aimed at producing waferboards of liquid phenol-formaldehyde adhesives with steam-injection pressing.With saturated steam of about 100℃ and pressing temperature 180℃,waferboards of poplar were made by different steam-injection times and hot-pressing times.Then the static bending strength,internal bond strength,water absorp- tion and thickness swelling of the samples were measured in order to study the influences of the two times(steam-injection time and the total hot-pressing time)on the properties of the boards.The results were:steam-injection pressing could shorten pressing time about 25%. The temperature of the injected steam was too low to produce phenol-formaldehyde wafer- boards.