摘要
The electrocrystallization mechanism of molybdenum was studied on platinum electrode bychronoamperometric method. The results show that the relationship between current and time remains agood linearity indicating that the electrodeposition of molybdenum is a process of three dimensionalhemispherical and progressive nucleation with growth of the nuclei controlled by diffusion. Thetechnological conditions of electroplating of molybdenum on nickel and copper substrates were also studiedand discussed.
The electrocrystallization mechanism of molybdenum was studied on platinum electrode bychronoamperometric method. The results show that the relationship between current and time remains agood linearity indicating that the electrodeposition of molybdenum is a process of three dimensionalhemispherical and progressive nucleation with growth of the nuclei controlled by diffusion. Thetechnological conditions of electroplating of molybdenum on nickel and copper substrates were also studiedand discussed.
