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Fabrication of Large-Area Field Emission Arrays by Bonding Technology

Fabrication of Large-Area Field Emission Arrays by Bonding Technology
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摘要 1 Introduction The recent development of vacuum microelectronics has received much attention. Vacuum microelectronic devices combine the vacuum transport of electrons with the microfabrication in the IC industry, and show a prospect of wide applications. If the devices can operate at moderate voltages, the electric field of about 1×10~7 V/cm is required. Sharp cathodes have to be fabricated so as to intensify the electric field near cathodes under a voltage. It is obvious that the fabrication of sharp cathodes is one of the
机构地区 Microelectronic Center
出处 《Chinese Science Bulletin》 SCIE EI CAS 1993年第22期1866-1869,共4页
基金 Project supported by the Youth Science Foundation of Southeast University.
关键词 VACUUM MICROELECTRONICS CATHODE FABRICATION bonding. VACUUM MICROELECTRONICS CATHODE FABRICATION BONDING
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