摘要
本文针对橡胶改性环氧树脂体系和玻璃珠改性环氧树脂体系,研究了影响界面残余应力的因素.填料的粒径不影响界面残余应力的测量.界面键合强弱的影响在两体系中不相同.
The factors were studied which had influence on the interfacial stress of rubber-modified epoxy resin system and glass-bead-modified epoxy resin system. The particle size of filler did not have influence on the residual interfacial stress. The strength of interfacial bonding showed different effect in the two systems.
出处
《热固性树脂》
CAS
CSCD
1993年第1期5-8,共4页
Thermosetting Resin
