摘要
本文概要叙述了近年来用于集成电路塑料封装的高纯度邻甲酚甲醛环氧树脂合成、降低水解氯等工艺技术的研究进展.
An outline was given of the high-purity o-cresol novolac epoxy resins used in encapsulation of integreted circuits in recent years, with stress laid upon the progress of the research work on the synthesis of the resins and the reduction of hydrolyzable chlorine content in them.
出处
《热固性树脂》
CAS
CSCD
1993年第1期46-49,共4页
Thermosetting Resin
