摘要
1H or 4He depth profiling in 1H or 4He implanted silicon samples was performed by elastic recoil detection (ERD) with multicharged 19F ions at a small accelerator. Optimization of the experimental parameters such as incident ions energy and scattering geometry were calculated by computer simulation. Depth resolution of about 20-30nm at depth of 400nm for 1H and at depth of 300nm for 4He can be obtained, respectively.
1H or 4He depth profiling in 1H or 4He implanted silicon samples was performed by elastic recoil detection (ERD) with multicharged 19F ions at a small accelerator. Optimization of the experimental parameters such as incident ions energy and scattering geometry were calculated by computer simulation. Depth resolution of about 20-30nm at depth of 400nm for 1H and at depth of 300nm for 4He can be obtained, respectively.
