利用俄歇电子能谱确定Au-Cu系统的互扩散系数及晶界扩散系数

DETERMINATION OF THE INTERDIFFUSION AND BOUNDARY DIFFUSION COEFFICIENTS OF THE Au-Cu SYSTEM BY AUGER ELECTRON SPECTROSCOPY

本文利用俄歇电子能谱(PHI-550)测得了经过不同时间间隔热处理的Au-Cu系统中铜在金薄膜内的浓度剖面。根据铜的浓度斟面及Hall公式,我们使用了两种方法——“中心梯度法”及“平坦区上升法”计算出Au-Cu系统的互扩散系数以及晶界扩散系数。本文还对上述计算结果进行了讨论。

In this paper the concentration profiles of copper in the gold thin film of the Au-Cu system after the heat treatment of different time-intervals have been measured by Auger electron spectroscopy (PHI 550). Based on the profiles of copper concentrations and Hall's formulae the interdiffusion coefficients of the Au-Cu system have been calculated by two methods, i. e., the 'center gradient method' and the 'plateau rise method', and the coefficients of grain boundary diffusion have been estimated as well. Discussions about the results have also been given in this paper.