摘要
Phase-stepping technique is applied to the analysis of fringe patterns of shadow moiré of electronic packages.Sensitivity of the fringe pattern analysis is demonstrated to be significantly increased.Thermally induced warpage of electronic packages is successfully measured in real-time as the sample is driven through a simulated reflow process.The paper discusses the technique of phase stepping,noise filtering and its application to the shadow moiré method.Applications of the technology are presented.
Phase-stepping technique is applied to the analysis of fringe patterns of shadow moirfi of electronic packages. Sensitivity of the fringe pattern analysis is demonstrated to be significantly increased. Thermally induced warpage of electronic packages is successfully meastlred in real-time as the sample is driven through a simulated reflow process. The paper discusses the technique of phase stepping, noise filtering and its application to the shadow moire method. Applications of the technology are presented.
出处
《实验力学》
CSCD
北大核心
2011年第5期556-564,共9页
Journal of Experimental Mechanics
关键词
英文摘要
内容介绍
编辑工作
期刊
shadow moire, printed circuit hoard warpage, electronic packages, fringe patternanalysis, phase stepping
