摘要
对环氧树脂LT-5078体系进行了粘度-温度、粘度-时间测试,研究了其粘度特性,通过动态DSC法测定了树脂的固化反应热,并通过外推法得到其特征固化温度和成型工艺条件。实验表明,LT-5078的凝胶温度、固化温度、后处理温度分别为42℃、102℃、185℃,固化工艺为25℃×24 h+120℃×4 h。该树脂25℃时由初始粘度250 mPa.s上升到800 mPa.s所用时间为170 min左右,常温下有较长的低粘度时长,适合真空辅助RTM成型。
The viscosity properties of epoxy LT-5078 system were investigated by the viscosity-temperature and viscosity-time testings.The curing reaction heat of the resin was determined by dynamic DSC and the characteristic curing temperature and molding process conditions were obtained by extrapolation method.The results showed that the gel temperature,curing temperature,post-treatment temperatures of LT-5078 were 42 ℃,102 ℃ and 185 ℃,respectively.The curing process was at 25 ℃ for 24 h and then at 120 ℃ for 4 h.The time of the resin from the initial viscosity 250 mPa · s up to 800 mPa · s at 25 ℃ was about 170 min.The resin had long time with low viscosity at room temperature and was suitable for vacuum-assisted RTM molding.
出处
《热固性树脂》
CAS
CSCD
北大核心
2011年第6期44-48,共5页
Thermosetting Resin
基金
山西省科技创新计划(2009101004)
