退火温度对Mo薄膜微观结构及形貌的影响

Influence of Annealing Temperature on Microstructure and Morphology of Mo Films

采用直流磁控溅射技术,制备了厚度为3.8μm的Mo薄膜,并对其在不同温度下进行了退火处理。采用白光干涉仪和SEM对Mo薄膜进行了表征,讨论了不同温度对薄膜表面形貌的影响;利用XRD对Mo薄膜的结构进行了分析。结果表明:随着退火温度由450℃升高到1 050℃,晶粒平均尺寸逐渐增大,微曲应力呈减小趋势;在温度高于900℃时,薄膜发生再结晶,同时表面有微裂缝及大量气孔出现;薄膜的表面粗糙度随退火温度的升高有逐步增大的趋势。

The Mo films of 3.8um was deposited before annealing at 450℃ - 1050℃ by DC magnetron sputtering on Mo substrates. The Mo films was characterized by the white light interferometer, SEM, and the effect of different temperature on the surface morphology of the film was disscussed; The structure of Mo films was analyzed by XRD. The results show that the grain size increases and microstrain decreases with increasing of the annealing temperature from 450℃ to 1 050℃ ; The Mo films recrystallizes after annealing at 900℃, and appears microcracks and pores; There is a trend that with increasing of the annealing temperature the surface roughness increases.