期刊文献+

镍对Ag-Cu-Sn-In钎料组织及加工性能的影响 被引量:7

Influence of Ni on microstructure and processing performance of Ag-Cu-Sn-In brazing alloy
下载PDF
导出
摘要 在制备Ag-Cu-Sn-In钎料、分析钎料组织的基础上,研究了添加Ni元素对钎料组织与加工性能的影响.结果表明,Ag-Cu-Sn-In合金组织由粗大的β-Cu枝晶、弥散分布于枝晶间的(α-Ag)相及少量Ag5Sn相组成.镍的添加可使钎料组织明显细化,熔点略有升高,并对钎料加工性能产生显著影响.随着镍含量的增大,合金形变率增大,钎料加工性能提高,含0.2%Ni的合金形变率达到峰值;继续升高镍含量,合金组织逐渐变得粗大,钎料加工性能变差.0.2%Ni钎料的固、液相线分别升高18℃和8℃,熔化温度区间减小20℃.采用退火轧制工艺,0.2%Ni钎料可轧制成厚为50~80μm的薄带.镍的适量添加可解决因银含量降低而引起的钎料加工性能恶化问题. Influence of Ni on the microstructure and processing performance of Ag-Cu-Sn-In brazing alloy was investigated.The microstructures of Ag-Cu-Sn-In of solder were composed of β-Cu coarse dendrite,(α-Ag) distributing in the interdendritic space and little Ag5Sn.By adding Ni element,the grains refined,the melting point rised a little,and processability was influenced evidently.With Ni content increasing,rate of deformation is bigger,processability of brazing alloy is better.As Ni content was 0.2%,the rate of deformation reached maxinum.Ni content sequentially increasing,microstructures of brazing alloy are becoming bulkily,and processability is worse.With 0.2% Ni Content,the temperature of solidus and liquidus of alloy foils increased respectively by 18 ℃ and 8 ℃,the temperature interval decreased by 20 ℃.After annealing treatment,brazing alloy with 0.2%Ni can be rolled into foils of 50-80 μm thickness.
出处 《焊接学报》 EI CAS CSCD 北大核心 2011年第11期65-68,116,共4页 Transactions of The China Welding Institution
基金 陕西省工业攻关计划资助项目(2009K06-14)
关键词 低银电真空钎料 合金熔点 微观组织 加工性能 lower silver electrical vacuum brazing filler melting point microstructure processability
  • 相关文献

参考文献10

  • 1Wingert P C, Leung C H. The development of silver-based cad- mium-free[ J]. IEEE Transactions on Components, Hybrids and Manufacturing Technology, 1989, 12(1): 16-20.
  • 2韩宪鹏,薛松柏,赖忠民,顾文华,顾立勇.无镉银钎料研究现状与发展趋势[J].焊接,2007(6):19-23. 被引量:25
  • 3Luo W C, Ho C E, Tsai J Y. Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations[ J]. Mate- rials Science and Engineering, 2005, 395 (28) : 385 -391.
  • 4Kozlova O, Voytovyeh R, Devismes M F. Wetting and brazing of stainless steels by copper-silver eutectic [ J ]. Materials Science and Engineering A ,2008,495 ( 15 ) : 96 - 101.
  • 5Kannachai K, Mongkol M, Tadashi A. Influence of indium addi- tion on characteristics of Sn-0.3Ag-0.7 C u solder alloy [ J ]. Jour- nal of Alloys and Compounds, 2009, 485 (10) : 225 -230.
  • 6Yoo Y C, Kim J H, Park K. Microstructural characterization of AI203/AISI 8650 steel joint brazed with Ag-Cu-Sn-Zr alloy[ J]. Materials'Letters, 2000, 42 (6) : 362 - 366.
  • 7钱耀川,丁华东,傅苏黎.陶瓷-金属焊接的方法与技术[J].材料导报,2005,19(11):98-100. 被引量:26
  • 8Dev S C, Mohanty 0 N. Rapidly sohdified low-silver brazing fill- er alloy foils[J]. Journal of Materials Science, 1994, 29(23 ) : 6329 - 6334.
  • 9刘泽光,王文祥,唐敏,等.低蒸汽压、低熔点银基钎料合金:中国,89106017[P]:1992—12—16.
  • 10李靖华.电真空焊料的熔炼[J].贵金属,2001,22(2):13-15. 被引量:2

二级参考文献46

共引文献50

同被引文献56

引证文献7

二级引证文献12

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部