摘要
将生物质资源淀粉在硫酸作用下水解,进而替代甲醛与苯酚进行缩聚反应生成淀粉基树脂,然后以六次甲基四胺交联固化,在反应前后进行了IR、XRD与SEM表征,并研究了产物的耐热性能。IR、XRD与SEM表明淀粉完全参加反应,凝胶反应时间随反应温度的升高而减小,制备所得淀粉基树脂具有较好的耐热性能,两种淀粉基树脂分别在550.3℃与551.4℃下具有50%的质量残留,热降解反应表观活化能分别为12.50kJ/mol和13.39kJ/mol。
Starch based phenolic resin was prepared by starch instead of formaldehyde. The phenolic resin was detected by IR, XRD, TG and SEM. Gel time decreased with the increase of gel temperature. Residual mass of starch based phenolic resin at 550℃ was 50%. The apparent activation energies for thermal degradation were 12.5kJ/mol and 13.39kJ/mol. The result showed that starch biomass could be used to prepare phenolic resin stead of formaldehyde.
出处
《化学与粘合》
CAS
2011年第6期5-7,共3页
Chemistry and Adhesion
基金
中央级公益性科研院所基本科研业务费专项资金(编号:CAFINT2009K06)
国家科技支撑计划项目(编号:2006BAD18B09)
关键词
生物质材料
淀粉
制备
耐热性能
biomaterial
starch
preparation
heat resistance
