摘要
铜丝表面镀钯是提高抗氧化性进而改善键合性能的有效手段。镀钯键合铜丝具有优异的综合性能,是半导体封装材料连接导线的新型材料。综述了镀钯键合铜丝国内外的发展现状、研究背景、镀钯工艺及金丝、铜丝和镀钯铜丝的比较。
The plating palladium on copper wire can effectively increase oxidation-resistance and then improve bonding property. The Pd-plated copper bonding wire of superior comprehensive performance will be new material suitable for connecting wire on semiconductor packaging. The developmental situation at home and abroad, the research background, the technology of palladium plating and the comparison among gold wire, copper wire and Pd-plated copper wire are reviewed.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2011年第21期104-107,128,共5页
Materials Reports
基金
昆明贵金属研究所基金(GY-10-RD03)
关键词
金属材料
半导体封装
镀钯键合铜丝
键合性能
metal material, semiconductor packaging, the Pd-plated copper bonding wire, bonding property
