期刊文献+

Collection efficiency and charge transfer optimization for a 4-T pixel with multi n-type implants 被引量:2

Collection efficiency and charge transfer optimization for a 4-T pixel with multi n-type implants
原文传递
导出
摘要 In order to increase collection efficiency and eliminate image lag, multi n-type implants were introduced into the process of a pinned-photodiode. For the purpose of improving the collection efficiency, multi n-type implants with different implant energies were proposed, which expanded the vertical collection region. To reduce the image lag, a horizontal gradient doping concentration eliminating the potential barrier was also formed by multi n-type implants. The simulation result shows that the collection efficiency can be improved by about 10% in the long wavelength range and the density of the residual charge is reduced from 2.59 × 10^9 to 2.62 × 10^7 cm^-3. In order to increase collection efficiency and eliminate image lag, multi n-type implants were introduced into the process of a pinned-photodiode. For the purpose of improving the collection efficiency, multi n-type implants with different implant energies were proposed, which expanded the vertical collection region. To reduce the image lag, a horizontal gradient doping concentration eliminating the potential barrier was also formed by multi n-type implants. The simulation result shows that the collection efficiency can be improved by about 10% in the long wavelength range and the density of the residual charge is reduced from 2.59 × 10^9 to 2.62 × 10^7 cm^-3.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2011年第12期91-94,共4页 半导体学报(英文版)
基金 Project supported by the National Natural Science Foundation of China(Nos.61036004,60976030)
关键词 CMOS image sensor PHOTODIODE collection efficiency charge transfer image lag CMOS image sensor photodiode collection efficiency charge transfer image lag
  • 相关文献

参考文献11

  • 1McColgin W C, Lavine J P, Kyan J, et al. Dark current quantization in CCD image sensors. IEDM Tech Dig, 1992:113.
  • 2Lee P P, Guidash R M, Stevens E G, et al. Active pixel sensor integrated with a pinned photodiode. USA Patent, No. 5625210, 1997.
  • 3Nakamura J. Image sensors and signal processing for digital still cameras. Boca Raton, FL: CRC Press, 2006:90.
  • 4Yu Junting, Li Binqiao, Yu Pingping, et al. Two-dimensional pixel image lag simulation and optimization in a 4-T CMOS image sensor. Journal of Semiconductors, 2010, 31 (9): 094011.
  • 5Stevens E G. Photodetector structure for improved collection efficiency. USA Patent, No. 20070069260A1, 2007.
  • 6Rhodes H E. Image sensor pixel having photodiode with multidopant implantation. USA Patent, No. 007670865B2, 2010.
  • 7Hynecek J. Stratified photodiode for high resolution CMOS image senor implemented with ST1 technology. USA Patent, No. 20100044824A1, 2010.
  • 8Patterson J J, Swenson M S, Dowley C I. Electronic components and methods for improving pixel charge transfer in the electronic component. USA Patent, No. 006476426B1,2002.
  • 9Shin B, Park S, Shin H. The effect ofphotodiode shape on charge transfer in CMOS image sensors. Solid-State Electron, 2010, 54: 1416.
  • 10Xu Jiangtao, Yao Suying, Li Binqiao, et al. Design, analysis, and optimization ofa CMOS active pixel sensor. Chinese Journal of Semiconductors, 2006, 27(9): 1548.

同被引文献6

引证文献2

二级引证文献3

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部