摘要
焦磷酸盐电镀Cu-Sn合金是替代氰化物镀Cu-Sn合金的最重要电镀工艺,但是它的最大缺点是电沉积速度慢、镀层耐腐蚀性差。本工作采用电化学方法和失重腐蚀试验,研究了添加剂对焦磷酸盐电镀Cu-Sn合金的电沉积速度、失重腐蚀速度、腐蚀电流密度等的影响。结果表明,焦磷酸盐电镀Cu-Sn合金的最佳添加剂是光亮剂乙二胺(EDA,0.5g/L)、辅助光亮剂甲醛(HCHO,0.5g/L)与表面张力处理剂(SDBS,0.5g/L)三者的复合。
Electroplating of Cu-Sn alloy coating in pyrophosphate bath is the most important electroplating process which can substitute Cu-Sn cyanide electroplating, but the biggest shortcoming of it is slow deposition rate and poor anti-corrosion properties of Cu-Sn alloy coating. The influence of additives on the properties of Cu-Sn coating was studied by electrochemical and weight-loss methods. The results showed that the optimal additives of pyrophosphate Cu-Sn electroplating are 0. 5 g/L ethylenediamine （brightener）, 0.5 g/L HCHO （auxiliary brightener） and 0.5 g/L SDBS （surfactant）.
出处
《腐蚀与防护》
CAS
北大核心
2011年第12期1009-1012,共4页
Corrosion & Protection
基金
材料腐蚀与防护四川省高校重点实验室科研基金资助(2009CL03)
