电路板铜阳极泥分银渣的还原熔炼

Reduction Smelting of Silver Separating Residue from Circuit Board Copper Anode Slime

采用还原熔炼的方法从电路板铜阳极泥分银渣中回收有价金属,在最佳还原熔炼条件下(温度1150℃、时间30～45min、Na2CO3用量15%、碳粉用量15%、硼砂用量6.0%～10.0%),还原熔炼产出的金属锭和渣分离好,金属产率达到65.2%,铅回收率97.84%,锡回收率88.88%,贵金属回收率均超过95%。

The recovery of valuable metals from silver separating residue from circuit board copper anode slime was studied by reduction smelting. The optimum reduction smelting conditions included temperature of 1 150 ℃, time of 30-45 min, consumption of Na2CO3 of 15%, consumption of carbon powder of 15%, and consumption of borax of 6.0%-10. 0%. As a result, the ingot was separated well from slag, and the metal production rate reached 65.2%, lead recovery was 97.84%, tin recovery was 88. 88%, and precious metal recovery was over 95%.