阻焊断桥问题原因探究与解决方法

Root cause and solution method of solder mask broken bridge

文章主要分析了PCB制造过程中阻焊断桥问题的产生原因,介绍了使用鱼骨图和难度-效益图查找关键影响因素的方法,通过试验,探索出油墨性能,曝光能量,显影速度和压力这几个因素的最佳控制范围。

Solder mask broken bridges often bother PCB manufacturers, so it is necessary to find out solutions to solve the problem. By experiment, this paper finds out that fishbone and difficulty-effect diagram are the effective ways to get the main factors which cause the problem. By analyzing the main factors, this paper learns that solder resist ink performance, exposure energy, develop speed and pressure must be well controlled within a certain scope during manufacturing.