摘要
孔壁分离是PCB及PCBA热处理过程中出现的一种缺陷,而且随着无铅化的到来,出现的频率越来越高。孔壁分离的影响因素较多,从PCB设计、PCB加工、PCB原材料性能等多个方面进行影响分析,并提出相应的改善措施。
Hole wall pull away is a reliability defect that appeared in the process of heat treatment of PCB and PCBA, and with the advancement of lead-free, the frequency of appearance increases. The defect has many impact factors. This article shows the impact factors analysis and improvements from the PCB design, PCB processing and PCB materials.
出处
《印制电路信息》
2011年第12期50-51,62,共3页
Printed Circuit Information
关键词
PCB
孔壁分离
除胶渣
化学铜
PCB
Hole wall pull away
desmear
electroless copper
