PCB甩线、铜皮分层缺陷的成因分析

The Root Cause Analysis of defects of track lift & delamination of PCB

PCB在生产过程中可能会产生各种缺陷,而甩线、铜皮分层是典型的PCB缺陷,通过对各种表象的PCB甩线、铜皮分层缺陷样品的分析研究,结合SEM、切片图片和EDS图表,阐述了PCB甩线、铜皮分层的主要成因。缺陷成因分析将有利于追溯缺陷形成的生产工序环节,理顺各级相关供应商责任,为供给双方更好的合作提供信赖的基础。

For a better cooperation and a firm mutual confidence with its customers, the author of this paper, with a cooperative attitude, assists in analysis of the root cause of defects of track lift, delamination of PCB. This is because only after PCB manufacturers get to know what the root cause is can they make complaints to the corresponding raw material supplier; and only when the process step, where the detects are made, is found can the technician trace the bad material. Trough collecting, analyzing, studying various track lift and delamination samples, the author of this paper illustrated key root causes with SEM, Cross - Section Pictures and EDS diagrams.