电子冷却热沉基板的三维数值优化

3D Numerical Optimization of a Heat Sink Base for Electronics Cooling

热管理问题对于电子装置或设备的长期可靠运行而言非常重要。以往,大量研究致力于优化用来移除电子装置废热的热沉结构,很少分析热沉基板作用。此处通过详细的无量纲化三维数值传热模型,探索不同的对流换热边界条件下可能的最优基板厚度。经计算,获得了不同换热机制下热沉与热源面积比和最低热阻间的关系,并对此进行讨论。另外还给出了这3个参数之间的简单拟合关系式,用于指导热沉的设计。

Thermal management of electronic devices has emerged as a very important issue for the reliability and long term operation of these devices or equipments.Tremendous efforts are given to the optimization of heat sinks which dissipate waste heat from these devices.However,the role of a base in a heat sink is seldom analyzed.In this investigation,throughout detailed numerical calculations with a nondimensionalized three dimensional heat transfer model, the possible optimal thickness of a base is explored with different convective heat transfer boundary conditions. From the calculations with the validated numerical solution ,the relations among the heat transfer mechanisms, the area ratios of a heat sink to a heating source, and the lowest thermal resistance is obtained and discussed.Also a simple correlation for these three parameters from data fitting is given for guiding the heat sink design.