熔炼工艺对Cu-10Ni-5Mo合金组织和导热性能的影响

Effects of Melting Process on Microstructure and Thermal Conductivity of Cu-10Ni-5Mo Alloy

采用真空非自耗电弧熔炼和真空高频感应熔炼喷铸成型2种熔炼工艺,制备Cu-10Ni-5Mo合金,研究了熔炼工艺对合金组织和导热性能的影响。结果表明,电弧熔炼制备的合金试样组织晶粒粗大,相组成为α固溶体和少量MoNi相;高频感应熔炼喷射成型工艺制备的合金试样组织晶粒细小,相组成为单相α固溶体。实验条件下,电弧熔炼工艺制备的合金试样热导率为56.9W/(m.K),高频感应熔炼喷射成型工艺制备的合金试样热导率为35.7W/(m.K),2种工艺制备的合金熔点均有提高,但二者相差不大。

Cu-10Ni-5Mo alloys were prepared by vacuum non-consumable arc-melting and vacuum high-frequency induction melting and injection moulding, respectively. The effects of melting processes on the microstructure of Cu-10Ni-5Mo alloys were studied. The results show that the crystal grain of Cu-10Ni-5Mo alloy prepared by the former is coarse, the microstructure of the alloy includes a solid solution and MoNi particles. The crystal grain of Cu-10Ni-5Mo alloy prepared by the later is superfine, the microstructure of the alloy is a solid solution. Under the experiment condition, the former coefficient of thermal conductivity is 56.9 W/（m · K）, the later is 35.7 W/（m ·K）. The melting points of all Cu-10Ni-5Mo alloys prepared by two methods are somewhat increased but both are not much different.