复合软磁材料密度与电绝缘特性的研究

Investigation on Density and Electric Insulation for Soft Magnetic Composite Materials

本文主要探讨了磷酸化处理、退火温度、成型压力对铁粉基复合软磁(SMC)材料电阻率、密度的影响。发现提高磷酸化过程中磷酸与铁粉的质量比可有效提高材料电阻率,但同时也降低了材料密度。提高退火温度,可以提高材料的密度,但是也会降低磷酸化材料的绝缘性。对于使用磷酸化粉末的复合软磁材料,退火温度不宜超过600℃。成型压力的增加有利于提高材料的密度。

We investigated the influences of phosphatization,annealing temperature and compacting pressure upon the density and resistivity of soft magnetic composite（SMC） materials based on the iron powders.In the phosphatization process of iron powders,the increase of mass ratio between phosphoric acid and iron powders increases the resistivity,but decreases the density of SMC materials.The increase of annealing temperature after compacting of powders can increase the density of phosphatizated SMC materials,but decrease the resistivity.For preparation of phosphatizated SMC materials,the appropriate annealing temperature should be less than 600 ℃.The higher compacting pressure contributes to the enhancement of density of SMC materials.