低银SnAgCu系无铅焊膏的板级工艺适应性研究

Investigation on board-level process adaptability of low-Ag lead-free solder paste

新开发了G-SAC105和G-SAC0307两种低银无铅焊膏,对其进行了板级封装的工艺适应性研究。结果表明,在(25±5)℃和120℃环境下,两种焊膏塌落度均为0.15 mm,在150℃环境下放置时,塌落度均为0.20 mm,都具有较好的抗热塌陷性,银含量的降低并不会影响焊膏的塌落度;焊膏印刷质量良好,焊后焊点光亮、饱满,未出现气孔或飞溅现象;焊态下G-SAC105和G-SAC0307金属间化合物厚度比较接近,均小于SAC305。

Low Ag lead-free solder pastes of G-SAC105 and G-SAC0307 were developed recently. The research of the board-level packaging process adaptability of solder pastes was carried out. Result shows that both of solder pastes have good property of anti-slump, the slumps of the pastes were 0.15 mm at （25±5）℃ or 120 ℃, and 0.20 mm at 150℃. Lower Ag contents in solder pastes do not affect the slump. Without any holes or splashing phenomenon, both the solder pastes show a high quali .ty of printing with bright plump solder joints. G-SAC105 and G-SAC0307 have similar thickness of the intermetallic compound that are lower than that of SAC305.