摘要
本文讨论了用含磷环氧树脂制备高Tg PCB基材的方法及其主要性能。
This paper has discussed a manufacturing method and primary propeties of the high Tg PCB base materials with the epoxy resins containing phosphorus.
出处
《覆铜板资讯》
2011年第6期41-43,23,共4页
Copper Clad Laminate Information
关键词
含磷环氧树脂
玻璃化温度
介电常数
介质损耗
The epoxy resins containing phosphorus,glass transition temperature,dielectric constant,dielectric loss tangent
