导电胶性能对器件分层的影响

Influence of the Properties of Conductive Adhesive on Delamination of the Devices

近年来客户对器件可靠性要求越来越高,而分层对可靠性的影响至关重要。跟分层密切相关的两种主要封装材料分别为塑封料和导电胶,文中重点对LQFP类导电胶进行性能比较、分层试验和相关性分析,明确了导电胶的相关性能对器件分层的影响程度,从而选择合适的导电胶来改善和提高器件的可靠性。

The customers are having higher and higher reliability requirements on devices in recent years. Delamination is critical to the reliability and two main assembly materials, molding compound and conductive adhesive are closely related to the delamination. This article elaborates the property comparisons of the conductive adhesive of LQFP package, delamination evaluations and correlativity analysis between them, definitude influece of the properties of conductive adhesive on delamination of the devices in order to select a proper conductive adhesive to improve and enhance the reliability of the devices.