气压渗流法制备的多孔铜的阻尼性能研究

Damping Behavior of Porous Cu Prepared by Pressure Infiltration Process

运用气压渗流法制备了多孔铜样品,并利用多功能内耗仪对材料的阻尼行为进行了研究。研究发现,材料的阻尼性能随孔隙率的增大或孔径的减小而提高,表明宏观孔是重要的耗能源。根据测量结果,对材料的可能阻尼机制进行了讨论。

The porous copper specimens were prepared using pressure infiltration process and the resultant damping behavior was investigated in the present study. It is found that the damping capacity of porous Cu increases with the increase of porosity or the decrease of pore size, which suggests that the macroscopic pores may be the dominant energy dissipation source. Based on the measuring results, potential damping mechanism of the material was discussed.