铜、镍对无铅焊点界面反应的影响

Influence of copper and nickel on interfacial reaction of lead free joints

界面反应对焊点性能和可靠性有重要影响。以目前引起广泛关注的Sn-Ag-Cu及Sn-Cu系无铅钎料为对象,分别讨论了Cu,Ni二种元素对无铅焊点界面反应的影响,分析了界面金属间化合物(IMC)的类型,形貌及物理性能的演变规律。在钎料中Cu含量的变化会影响钎料对基板的熔蚀能力,同时也能够改变IMC的类型,进而促进IMC发生大规模剥离现象。加人到钎料或铜基板中的微量Ni都可以改变IMC厚度及IMC的稳定性。

The interfacial reaction is proven to have a significant effect on the properties and reliabilities of joints.The Sn—Ag-Cu and SnCu solders attracted wide attention at present were used as research objects in.And the effects of copper and nickel on the interfacial reaction of lead free soldered joints were studied,respectively.The types and morphology of the intermetallic compounds(IMC) as well as their physical properties were also analyzed.The variation of copper content in solders can change the dissolution of substrates and the types of the IMC, and then cause the massive spalling.Trace amount of nickel in solders or copper substrate can change the thickness and the stability of the IMC.