用于涂层导体的Ag/立方织构Cu复合基带的制备

Preparation of Ag/cubic textured Cu composite tapes for coated conductor

通过二次冷轧铜棒并850℃恒温热处理,制备出具有较强立方织构的Cu基带。以硝酸银、亚硫酸钠和硫代硫酸钠为主要原料配制镀银液,在立方织构Cu基带上制备出具有较强Ag(200)择优取向的银镀层。在600℃恒温热处理30min后Ag膜仍具有(200)择优取向,而830℃热处理后,Ag会扩散到Cu基底中,重复镀银、热处理5次后,Ag膜具有(200)的择优取向并少量面内织构,所得Ag/立方织构Cu复合带材可作为第二代高温超导带材YBCO涂层导体的金属基底。

Cubic textured Cu tapes were prepared by cold rolling twice combined 850℃ post heat treatment.Uniform Ag films were deposited on cubic textured Cu tapes by electroless plating with silver nitrate,sodium sulfite and sodium thiosulfate as the main raw materials.Ag films retained（200） preferred orientation when heated to 600℃ holding for 30min.But when the temperature was raised to 830℃,Ag films spreaded to Cu substrates.Only after repeated electroless plating silver and 830℃ heat treatment five times,Ag films showed（200） preferred orientation and a small amount of in-plane texture.The final Ag/cubic textured Cu composite tapes can be metallic substrates of the second generation high temperature tapes YBCO coated conductor.