摘要
本文研究了第三组份对CuO—H_3PO_4无机胶粘剂的影响,试验结果表明:粘接强度可大幅度增加,最高可增加2.4倍。同时还研究了高温钝化,发现钝化温度以0.75Tm较为适宜。
The effect of third component on CuO-H_3PO_4 inorganic adhesive has been studied. Experimental results showed that the bonding strength can be increased sharply up to 3.4-fold. Passivation of CuO at high temperature has also been studied. It was found that the optimal temperature for passivation is 0.75Tm.
出处
《粘接》
CAS
1990年第6期12-14,共3页
Adhesion
基金
国家自然科学基金
