摘要
分析了工艺参数(如温度、pH值、沉积时间等)的变化时印刷线路板(PCB)表面化学镀镍/置换镀金层性能的影响。结果表明:工艺参数对镀层性能具有较大影响。在此基础上优化了化学镀镍/置换镀金工艺,获得了性能良好的镍/金镀层。
The effects of technological parameters, such as temperature, pH and deposition time on the properties of electroless nickel and immersion gold coating on printed circuited board (PCB) are discussed. The results show that technological parameters have a great influence on the properties of electroless nickel and immersion gold coating. On this basis, the electroless nickel/immersion gold process is optimized, obtaining a good nickel/gold coating.
出处
《电镀与环保》
CAS
CSCD
北大核心
2012年第1期15-18,共4页
Electroplating & Pollution Control
基金
哈尔滨工业大学(威海)研究基金(HIT(wh)XB200802)
中央高校基本科研业务费专项资金资助(HIT.NSRIF.2009155)
关键词
印刷线路板
化学镀镍
置换镀金
工艺参数
printed circuited board
electroless nickel
immersion gold
technological parameter