电解铜箔织构的研究

Study on Texture of Electrolytic Copper Foil

在CuSO4-H2SO4电解液体系中,电沉积铜箔试样。利用X射线衍射仪研究了不同电沉积条件下制备的铜箔材料的织构特征。结果表明,铜箔织构度随厚度的增加而提高,(111)织构逐渐向(220)织构转变,最终形成(220)强织构;铜箔织构度随电流密度的不同而改变,并且电流密度越大,越有利于(220)织构的形成,使得铜箔织构度越强;同时,电解铜箔织构类型以及织构度对铜离子浓度没有无关。

The copper foil samples were prepared in CuSO4-H2SO4 electrolyte system, the texture of copper foil which was electrodeposited under different conditions was studied by X-ray diffraction （XRD）. The results show that the texture coefficient （TC） is enhanced by the increase of copper foils thickness, the （111） texture gradually transforms into （220） texture, eventually forms （220） strong texture; the extent texture of copper foils changes with the current density, the high current density is advantageous to the formation of （220） texture and increase the TC value of copper foil. Simultaneously, the type and extent of the texture has nothing to do with Cu2＋ concentration.