摘要
为实现毫米波多级固态功放小型化设计,根据传统Wilkinson功分器的设计原理,以新型材料以及薄膜电路加工工艺为基础,在HFSS中仿真设计了一款集成薄膜电阻的Ka波段Wilkinson功分器,其在10 GHz带宽内具有插损低,驻波小和隔离度高等特点,且尺寸小,结构简单,易于生产,适合于芯片功率合成或其他毫米波电路小型化设计应用。
In order to realize the Miniaturization of Millimeter Wave（MMW） multilevel solid-state power amplifier, according to the traditional design principles of Wilkinson power divider, this paper presents a Ka-band Wilkinson power divider with chip resistor integrated. The highlight of this design is the use of high precision materials and thin-film technique. Simulation results show that it bears the attributes of low insertion loss, low standing, wave, and high isolation in 10 GHz bandwidth. The divider is very small and easy to be fabricated for its simple structure, which is very suitable for the chip-level power synthesis and other miniaturized design of MMW circuit.
出处
《信息与电子工程》
2011年第6期722-724,共3页
information and electronic engineering
