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THE EFFECT OF BILINEAR BEHAVIOUR ON THE DIRECTION AND MAGNITUDE OF THE PEELING MOMENT IN A BI-MATERIAL BEAM

THE EFFECT OF BILINEAR BEHAVIOUR ON THE DIRECTION AND MAGNITUDE OF THE PEELING MOMENT IN A BI-MATERIAL BEAM
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摘要 In this work a bi-material beam exhibiting partly bilinear behaviour under a uniform temperature change is analyzed. The essence of solution is based on the approach of Timoshenko's mechanics of materials, The main aim of the present analysis is to understand the effect of the bilinear behaviour on the peeling moment. This theoretical mechanics model mentioned here can give us useful insights to improve the resistance against the delamination. In this work a bi-material beam exhibiting partly bilinear behaviour under a uniform temperature change is analyzed. The essence of solution is based on the approach of Timoshenko's mechanics of materials, The main aim of the present analysis is to understand the effect of the bilinear behaviour on the peeling moment. This theoretical mechanics model mentioned here can give us useful insights to improve the resistance against the delamination.
作者 Ugur Gven
出处 《Acta Mechanica Solida Sinica》 SCIE EI 2011年第6期506-509,共4页 固体力学学报(英文版)
关键词 peeling moment layered structures interface thermo mechanical DELAMINATION peeling moment, layered structures, interface, thermo mechanical, delamination
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参考文献17

  • 1Timoshenko,S.P., Analysis of bimetal thermostats. Journal of Optical Society American, 1925, 11: 233-255.
  • 2Hess,M.S., The end problem for a laminated elastic strip--I. The general solution. Journal of Composites Materials, 1969, 3: 262-280.
  • 3Hess,M.S., The end problem for a laminated elastic strip--II. Differential expansion stresses. Journal of Composites Materials, 1969, 3: 630-641.
  • 4Suhir,E., Stresses in bimetal thermostats. ASME Journal of Applied Mechanics, 1986, 53: 657-660.
  • 5Suhir,E., Interfacial stresses in bimetal thermostats. ASME Journal of Applied Mechanics, 1989, 56: 595- 600.
  • 6Suhir,E., Predicted thermal stresses in a bi-material assembly adhesively bonded at the ends. Journal of Applied Physics, 2001, 89: 120-129.
  • 7Mirman,I.B., Effects of peeling stresses in a bi-material assembly. ASME Journal of Electronic Packaging, 1991, 113: 431-433.
  • 8Mirman,I.B., Microelectronics and the built-up-bar theory. ASME Journal of Electronic Packaging, 1992, 114: 384-388.
  • 9Mirman,I.B., Interlaminar stresses in layered beams. ASME Journal of Electronic Packaging, 1992, 114: 389-396.
  • 10Moore,T.D. and Jarvis,J.L., A simple and fundamental design rule for resisting delamination in bi-material structures. Microelectronic Reliability, 2003, 43: 487-494.

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