表面硅烷化纳米银粉导电胶性能研究(英文)

Study on Properties of Conductive Adhesive Prepared with Silver Nanoparticles Modified by Silane Coupling Agent

采用经硅烷偶联剂KH-560表面改性的纳米银粉作为填料,环氧树脂为基体在180℃固化得到银导电胶。借助透射电子显微镜(TEM)、红外光谱(FTIR)、差示扫描量热法(DSC)等测试手段,对改性后纳米银粉和导电胶进行了表征。研究了银粉含量、固化时间对导电胶性能的影响。结果表明:KH-560改性后的纳米银粉平均粒径为20 nm,分散均匀;KH-560以化学键合的方式吸附在纳米银颗粒的表面。银粉含量、固化时间等均会影响导电胶的性能。当银粉含量为55%,固化时间为15 min时,导电胶的体积电阻率达最小值为2.5×10-3Ω·cm。与未做任何表面处理的纳米银粉填充的导电胶相比, KH-560改性后纳米银粉所得导电胶的电导率提高了3-5倍。

Silver nanoparticles modified by silane coupling agent KH-560 were used as conductive filler to prepare conductive adhesive at 180 ℃ in epoxide resin vehicles.The as-modified Ag nanoparticles and conductive adhesive were characterized by transmission electron microscopy（TEM）,Fourier transform infrared spectra（FTIR） and differential scanning calorimetry（DSC）.The effects of silver content and curing time on the properties of conductive adhesive were studied.The results show that KH-560 modified Ag powders with a particle size of approximately 20 nm are uniformly dispersed and KH-560 molecules are adsorbed on silver particle surface.Silver content and curing time could influence the properties of conductive adhesive significantly.The bulk resistivity of conductive adhesive with 55 wt% silver nanoparticle and curing time of 15 min reaches a minimal value of 2.5×10-3 Ω·cm.Compared with the conductive adhesive filled with unmodified silver nano-powders,the bulk resistivity of conductive adhesive filled with modified silver nano-powders increases by 3-5 times.