铜箔制程对CCL及PCB要求的应对

Production process of copper foils to meet requirements of CCL and PCB

PCB和CCL行业的高速发展,对作为其基础材料的铜箔提出了更多要求。铜箔必须同时满足PCB和CCL的多项性能要求,这给铜箔生产商带来了严峻的技术挑战和难得的发展机遇。从铜箔生产制成控制原理、方法和实际管控等方面,讨论铜箔如何应对CCL和PCB高度发展要求。

As basic materials,copper foils are proposed more requests with rapid development of PCB and CCL industry.In order to meet many performance requirements at the same time,the manufacturers of copper foils are faced with rigorous challenge of technologies and precious development opportunities.In this paper,the production process of copper foils,including control principle,method and actual control and so on,are discussed to meet the requests of rapid development of PCB and CCL industry.