摘要
以2009年~2010年发表的半固化片浸渍加工技术与设备的日本专利为研究对象,对此创新内容及思路作以综述。
In the paper,the technology and equipment about impregnation processability of prepreg based on Japanese patent from 2009 to 2010 are researched.At the same,content and method of innovation were reviewed.
出处
《印制电路信息》
2012年第1期15-20,共6页
Printed Circuit Information
关键词
印制电路板
覆铜板
浸渍加工
半固化片
Printed Circuit board(PCB)
Copper Clad Laminate(CCL)
impregnation processability
prepreg