电子封装级特种树脂的研究进展

Advances of Resins in Electronic Packaging

随着对电子产品的多功能、高性能要求越来越高,电子封装材料的种类和性能也随之飞速发展。本文根据目前封装材料的发展情况,对常用的酚醛树脂(PF)、环氧树脂(EP)、聚酰亚胺树脂(PI)、双马来酰亚胺树脂(BMI)、苯并嗯嗪树脂(BOZ)、氰酸酯树脂(CE)的基本性能和研究进展进行了综述。

With higher requirements of multi - functional and high - performance in electronic products, types and performance of electronic packaging materials developed rapaidly. Based on the current development of packaging materials, the basic performance and research progress of phenoliresin（ PF）, epoxide resin（ EP）, polymide（ PI）, bismaleimide （BMI） , benzoxazine resin（BOZ） , and cyanate resin（CE） , were reviewed.