摘要
文章建立了RGB三合一LED背光模组的热分析模型,通过与红外热像仪实际测量得到的温度数据相互比较,验证了该模型仿真结果的准确性。模拟分析的结果表明,在LED阵列底部固定一块镀锌钢板可有效降低LED结温。文章还提出了一种利用最小二乘法原理推算LED结点温度的方法,得到了电路板表面温度与LED结温之间的关系式,有助于通过测量电路板温度估算LED的结点温度,并以此为根据对LED进行亮度和色度的调节。
This paper presents a thermal design of the light emitting diode （LED） with 3 chips and its array. The accuracy of the module is verified though a comparison with actual data which is measured by the infrared thermograph. The simulation results show that adding a galvanized steel sheet helps reduce the junction temperature of LEDs. In addition, a method to reckon the junction temperature of LEDs using least square method is studied to calculate the relationship between the temperature of circuit board surface and the junction temperature of LEDs, which contributes to adjust the luminance and chromaticity in real time.
出处
《现代显示》
2012年第1期35-39,共5页
Advanced Display
关键词
LED
背光模组
热管理
数据处理
LED
backlighting module
thermal analysis
data analysis
