摘要
研究了土壤Cu2+胁迫对丹参(Salvia miltiorrhiza Bunge)的生长和有效成分积累的影响。结果表明,与对照相比,Cu2+胁迫下丹参的生长受到抑制,土壤和丹参体内Cu2+残留量、膜脂过氧化程度增加,而叶绿素含量降低。此外,与对照相比,Cu2+胁迫下丹参地上部分中水溶性酚酸类成分咖啡酸、丹参素和原儿茶酸含量增加,迷迭香酸、原儿茶醛和丹酚酸B含量显著降低,而根系中这6种酚酸类成分和4种脂溶性丹参酮类成分二氢丹参酮、隐丹参酮、丹参酮Ⅰ、丹参酮ⅡA的含量均降低。表明铜胁迫抑制了丹参的生长,影响了有效成分的积累。
The effects of copper stress on seedlings growth and active ingredients of Salvia miltiorrhiza were investigated.The results showed that copper stress inhibited seedlings growth,increased Cu2+ accumulation in both soil and seedlings.Moreover,a reduction in photosynthetic pigments and an increase in the levels of TBARS content of stressed seedlings showed that oxidative stress and lipid peroxidation were provoked.The effects of the treatment on active ingredients accumulations in above-ground parts and roots were different.In above-ground parts of copper stressed seedlings,the accumulations of caffeic acid,tanshinol and protocatechuic acid increased,while the contents of rosmarinic acid,protocatechuic aldehyde and salvianolic acid B decreased.However,the accumulations of both six phenolic acids and four tanshinone ingredients all decreased in stressed roots.All these results showed that copper stress had a toxic effect on both S.miltiorrhiza growth and 10 mainly active ingredients accumulations.
出处
《植物研究》
CAS
CSCD
北大核心
2012年第1期124-128,共5页
Bulletin of Botanical Research
基金
教育部高等学校博士学科点专项科研基金(200807181002)
陕西师范大学优秀科技预研项目(200902003)
上海辰山植物园科研专项课题(G102404)
关键词
丹参
铜胁迫
生长
膜脂过氧化
有效成分
Salvia miltiorrhiza Bunge
copper stress
growth
lipid peroxidation
active ingredients