超声雾化工艺参数对无铅钎料粉体质量的影响

Effects of ultrasonic atomizing process parameters on the quality of lead-free solder powders

采用正交试验研究了超声雾化工艺参数对SnAgCu系无铅钎料粉体质量的影响规律。结果表明:当熔化炉炉腔内氮气压力为1.2 MPa、液态钎料出口温度为340℃、雾化室氮气进风量为2.1 m3/min、超声雾化头振幅为7.5μm时,SnAgCu系无铅钎料的出粉率可达65.6 kg/h,且获得粉体粒径不大于75μm的粉体质量分数为94%,粉体中氧的质量分数保持在64×10–6以下,炉内氮气的压力对粉体的出粉率和粒径分布的影响起决定作用。

Orthogonal experiment method was used to investigate the effects of ultrasonic atomizing process parameters on the quality of SnAgCu lead-free solder powders. The results show that when the nitrogen pressure in the stove is 1.2 MPa, the outflow temperature of the molten solder is 340 ℃, the input volume of nitrogen is 2.1 m3/min and the ultrasonic amplitude is 7.5μm, the powder output rate can reach 65.6 kg/h and the mass fraction of powder whose particle diameter is under 75 μn can reach 94% and the mass fraction of oxygen in solder powder can be below 64× 10-6. Nitrogen pressure in stove has a crucial effect on the output rate and particle distribution of powder.