运动规划在摆臂机构上的应用分析

Analysis of Motion Planning on Bond Arm

摆臂机构是一些半导体封装设备上的重要组成机构,其运动的稳定性是整个封装动作的关键。由于其高速运动的特性容易引起机构振动造成产品品质下降,通过对摆臂机构进行分析,采用模拟量PID控制和S形速度曲线,对摆臂机构的两个伺服电机进行运动规划,有效地抑制了摆臂在吸固晶时产生的振动,并缩短了工作周期,从而提高了设备的效率和精度。

Bond arm is an important structure in some packaging equipment.The stability of bond arm is the critical part in whole packaging.The vibration is caused because of the high speed character of bond arm,so the quality is dropped.Through analyzing the structure of Bond Arm in this paper,S-curve and PID control are adopted.Motion planning is applied on the two servo motor in bond arm.The vibration in pick up and bond motion of bond arm is restrained effectively.Time of work cycle is reduced,and the efficiency and precision of the equipment are improved.