摘要
随着先进集成电路封装技术的快速发展以及全球环境保护呼声的日益高涨,绿色环保无卤阻燃环氧塑封料得到了越来越广泛的重视。文章综述了近年来国内外在绿色无卤阻燃环保塑封料研究与开发领域内的最新进展。分别介绍了均聚型、共聚型以及含氟苯酚-芳烷基型酚醛树脂固化剂、环氧树脂以及塑封料的阻燃机制、研究现状以及发展趋势。同时介绍了中国科学院化学研究所在相关领域内的研究进展情况,最后对我国绿色环保塑封料产业的发展前景进行了展望。
With the rapid development of advanced microelectronic packaging and the ever-rising demands of global environmental protection, halogen-free flame retardant epoxy molding compounds （EMCs） have been paid much attention in recent years. Recent research and development of halogen free flame retardant EMCs have been reviewed in the present work. The homo-polymerized, copolymerized and fluorinated phenol-aralkyl phenolic resin hardener, epoxy, and EMC were separately summarized. The present status of green EMCs studies in 1CCAS was also introduced. Finally, the future developing trends of green EMC industry in China are prospected.
出处
《电子与封装》
2012年第1期1-6,共6页
Electronics & Packaging
基金
科技部02专项资助课题(课题编号:2009ZX01010-007)
关键词
环氧塑封料
酚醛树脂
苯酚-芳烷基
无卤阻燃
epoxy molding compound
phenolic resin
phenol-aralkyl
halogen-flee retardant
