摘要
以苯基三甲氧基硅烷、二苯基二甲氧基硅、二甲基二乙氧基硅烷、二乙烯基四甲基二硅氧烷、二氢基四甲基二硅氧烷、六甲基二硅氧烷等为原料,制备了高折射率加成型双组分甲基苯基乙烯基硅树脂;并将其用于功率型(1～3 W)发光二极管(LED)5050的封装,然后进行常温点亮试验、高温点亮试验、回流焊试验、-40～100℃冷热冲击试验和墨水渗透试验。结果表明,各项指标均合格,其性能可与国外同类产品相近。
Taking phenyltrimethoxysilane,dimethyldiethoxysilane,diphenyldimethoxysilane,divinyltetramethyldisiloxane,dihydridotetramethyldisiloxane,and hexamethyldisiloxane as the raw materials,an addition type two-component molding vinyl methyl phenyl silicone resin with high refractive index was successfully prepared and applied to a power-type（1-3w） LED 5050 product packaging process.The experimental products were used for ambient temperature lighting test,high temperature lighting test,reflow test,-40～100 ℃ hot and cold impact test,and ink penetration test,suggesting that the product meets the requirements and its performance is comparable with the similar foreign products.
出处
《有机硅材料》
CAS
2012年第1期34-38,共5页
Silicone Material
关键词
发光二极管
折射率
苯基
硅树脂
加成型
双组分
LED
refractive index
phenyl
silicone resin
addition type
two-component
