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Local thermal conductivity of polycrystalline AlN ceramics measured by scanning thermal microscopy and complementary scanning electron microscopy techniques

Local thermal conductivity of polycrystalline AlN ceramics measured by scanning thermal microscopy and complementary scanning electron microscopy techniques
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摘要 The local thermal conductivity of polycrystalline aluminum nitride (A1N) ceramics is measured and imaged by using a scanning thermal microscope (SThM) and complementary scanning electron microscope (SEM) based techniques at room temperature. The quantitative thermal conductivity for the A1N sample is gained by using a SThM with a spatial resolution of sub-micrometer scale through using the 3w method. A thermal conductivity of 308 W/m-K within grains corresponding to that of high-purity single crystal A1N is obtained. The slight differences in thermal conduction between the adjacent grains are found to result from crystallographic misorientations, as demonstrated in the electron backscattered diffraction. A much lower thermal conductivity at the grain boundary is due to impurities and defects enriched in these sites, as indicated by energy dispersive X-ray spectroscopy. The local thermal conductivity of polycrystalline aluminum nitride (A1N) ceramics is measured and imaged by using a scanning thermal microscope (SThM) and complementary scanning electron microscope (SEM) based techniques at room temperature. The quantitative thermal conductivity for the A1N sample is gained by using a SThM with a spatial resolution of sub-micrometer scale through using the 3w method. A thermal conductivity of 308 W/m-K within grains corresponding to that of high-purity single crystal A1N is obtained. The slight differences in thermal conduction between the adjacent grains are found to result from crystallographic misorientations, as demonstrated in the electron backscattered diffraction. A much lower thermal conductivity at the grain boundary is due to impurities and defects enriched in these sites, as indicated by energy dispersive X-ray spectroscopy.
作者 张跃飞 王丽 R.Heiderhoff A.K.Geinzer 卫斌 吉元 韩晓东 L.J.Balk 张泽 Zhang Yue-Fei;Wang Li;R.Heiderhoff;A.K.Geinzer;Wei Bin;Ji Yuan;Han Xiao-Dong;L.J.Balk;Zhang Ze(Institute of Microstructure and Property of Advanced Materials,Beijing University of Technology,Beijing 100124,China;Department of Electronics,Faculty of Electrical,Information and Media Engineering,University of Wuppertal,Wuppertal D-42119,Germany;Department of Materials Science,Zhejiang University,Hangzhou 300038,China)
出处 《Chinese Physics B》 SCIE EI CAS CSCD 2012年第1期374-379,共6页 中国物理B(英文版)
基金 Project supported by the National Basic Research Program of China(Grant No.2009CB623702) the National Natural Science Foundation of China(Grant No.10904001) the Key Project Funding Scheme of Beijing Municipal Education Committee,China(Grant No.KZ201010005002)
关键词 thermal conductivity A1N ceramics scanning thermal microscopy scanning electronmicroscopy thermal conductivity, A1N ceramics, scanning thermal microscopy, scanning electronmicroscopy
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  • 1AIShaikhi A and Srivastava G P 2008 J. Appl. Phys. 103 083554.
  • 2Slack G A, Tanzilli R A, Pohl R 0 and Vandersande J W 1987 J. Phys. Chem. Solids 48 641.
  • 3Medraj M, Baik Y, Thompson W T and Drew R A L 2005 J. Mater. Proc. Technol. 161 415.
  • 4Franco J A and Shanafield D J 2004 Ceramica 50 247.
  • 5AIShaikhi A and Srivastava G P 2009 J. Phys.: Condens. Matter 21 174207.
  • 6Wang Z L, Tang D W, Jia T and Mao A M 2007 Acta Phys. Sin. 56 747.
  • 7Fenwick 0, Bozec L, Credgington D, Hammiche A, Lazzerini G M, Silberberg Y Rand Cacialli F 2009 Nat. Nanotechnol. 4664.
  • 8Zhang Y F, Wang L, Ji Y, Han X D, Zhang Z, Heiderhoff R, Tiedemann A K and Balk L J 2009 IEEE Proceedings of 16th IPFA CFP09777-CDR 520.
  • 9Tiedemann A K, Heiderhoff R, Balk L J and Phang J C H 2009 IEEE Proceedings of 16th IPFA CFP09RPS-CDR 327.
  • 10Feng P and Wang T H 2003 Acta Phys. Sin. 52 2249.

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