期刊文献+

LDI和喷印技术是解决“甚高密度”PCB的最佳出路 被引量:7

The technology of LDI and ink-jet printing is best road of very-high density PCB
下载PDF
导出
摘要 概要地说明"甚高密度"PCB遇到了精细图形和对位度的挑战,而采用激光直接成像(LDI)和喷印技术可以顺利地解决这些问题,并有利于环境保护、清洁生产和降低成本。 The paper describes that the challenge of fine-line and ability for counterpoint in very-high density PCB.The best method of resolving these problems is applying technology of LDI and ink-jet printing,which have advantageous of the environmental protection,cleaning production and decreasing cost.
出处 《印制电路信息》 2011年第11期18-21,共4页 Printed Circuit Information
关键词 甚高密度 激光直接成像 喷墨打印 功能油墨 精细导线 对位度 very-high density LDI ink-jet printing functional ink fine-line ability for counterpoint
  • 相关文献

参考文献1

二级参考文献8

  • 1"Screen Printing Process for High Density Flexible Electronics",Robert Turunen,Dominique Numakura, Masafumi Nakayama and Dominique Numakura, Printed Circuit FAB, October, 2007, http://pcdandm.com/cms/ content/view/3846/95/.
  • 2"Advanced Screen Printing Process"Practical Approaches for Printable & Flexible Electronics", Dominique Numakura, 3rd IMPACT and the 10th EMAP. October 2008.
  • 3沼倉研史.ブリソタブル·ェレクトロニクス,ェレクトロニクス実裝技術,2008.12(vol.24,no,12).
  • 4沼倉研史.ブリソタブル·ェレクトロニクス,ェレクトロニクス実裝技術,2009.1(vol.25,no.1).
  • 5沼倉研史.ブリソタブル·ェレクトロニクス,ェレクトロニクス実裝技術,2009.2(vol.25,no.2).
  • 6DKN リサ一チホ一ムベ一ジ (http://www.dknresearch. com).
  • 7ェヌヮィ工業 (株) ホ一ムベ一ジ(http://www.ny1.co.jp).
  • 8"Screen Printing Process for High Density Flexible Electronics",Robert Turunen, Dominique Numakura, Masafumi Nakayama and Hisayuki Kawasaki, IPC Printed Circuit Expo/APEX and the Designers Summit, April 2008.

共引文献1

同被引文献37

引证文献7

二级引证文献7

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部