摘要
目前PCB行业对于半孔的制作方法,主要采用二次钻法或二次铣法,成本高,生产周期长,而且不利于低碳环保的理念。于是导入冲切半孔这个课题,并评估其可行性。
At present,in the PCB industry,the method of making half hole is mainly using 2nd drilling or 2nd routing.This method cost too much money and have a long production period,and against the concept of low carbon and environmental protection.So I imported the subject of punching PCB Half-hole,and then assessed the feasibility.
出处
《印制电路信息》
2011年第11期33-36,共4页
Printed Circuit Information
关键词
半孔板
冲板
低碳环保
可行性
板厚
孔径
PCB Half-hole
punch board
low carbon and environmental protection
feasibility
thickness of plating
hole diameter
