表面贴装晶圆视觉检测技术的研究

Research on visual inspection for surface pasted wafer

视觉检测是半导体贴装设备的核心技术之一,该文重点阐述了视觉检测系统的总体设计,并提出一种检测晶圆偏转角度的有效算法。利用这些图像处理技术对芯片边缘点进行采集,并拟合成直线,从而计算出晶圆的偏转角度。实验结果表明,该系统具有较高的准确度,并且满足系统的实时性要求。

Vision inspection is one of core technology on the semiconductor pasted equipment.This article introduces the overall design of vision inspection system and brings a efficient algorithm of deflect angle inspection for the wafer.Using these image processing technology to collect the collinear point of the chip,and fit these point to a straight line,thereby calculate deflect angle of the chips.Experimental results show that the system has high accuracy,and meet the require of real time in the systerm.