摘要
视觉检测是半导体贴装设备的核心技术之一,该文重点阐述了视觉检测系统的总体设计,并提出一种检测晶圆偏转角度的有效算法。利用这些图像处理技术对芯片边缘点进行采集,并拟合成直线,从而计算出晶圆的偏转角度。实验结果表明,该系统具有较高的准确度,并且满足系统的实时性要求。
Vision inspection is one of core technology on the semiconductor pasted equipment.This article introduces the overall design of vision inspection system and brings a efficient algorithm of deflect angle inspection for the wafer.Using these image processing technology to collect the collinear point of the chip,and fit these point to a straight line,thereby calculate deflect angle of the chips.Experimental results show that the system has high accuracy,and meet the require of real time in the systerm.
出处
《工业仪表与自动化装置》
2011年第5期27-29,45,共4页
Industrial Instrumentation & Automation
基金
江苏省科技支撑计划(工业)项目(BE2010061)
江苏省产学研联合创新资金计划项目(BY2009119)
关键词
表面贴装
视觉检测
偏角检测
直线拟合
surface pasted
vision inspection
deflection angle inspection
straight line fitting