5(6)-氨基-1-(4-氨基苯基)-1,3,3-三甲基茚满的合成及其固化特性研究

SYNTHESIS AND CURING BEHAVIOR OF 5(6)-AMINO-1-(4-AMINOPHENYL)-1,3,3-TRIMETHYLINDANE

以1,3,3-三甲基-1-苯基茚满为原料,通过硝化、还原反应制备5(6)-氨基-1-(4-氨基苯基)-1,3,3-三甲基茚满(PI-DA),其结构经FTIR、1H-NMR和LC-MS表征。以PIDA为固化剂,用DSC研究了E-44/PIDA固化反应,确定固化工艺条件,并用Kissinger及Ozawa方法分别计算得到该体系固化反应的表观活化能为56.48kJ/mol和60.76kJ/mol,结合Crane公式求出反应级数为0.88。研究结果表明,与4,4’-二氨基-二苯砜(DDS)相比,PIDA熔点较低且带有环状茚满结构,既降低了固化温度、缩短了固化时间,又提高了复合材料的耐热性。E-44/PIDA复合材料的玻璃化转变温度Tg=167.8℃,初始分解温度Td=361.71℃。

5（6）-amino-1-（4-aminophenyl）-1,3,3-trimethylindane（PIDA） was obtained by the reaction of nitration and reduction from 1,3,3-trimethyl-1-phenylindan,the structure was characterized by FTIR,1H-NMR and LC-MS.The curing behaviors of system were composed of this new curing agent and E-44 epoxy resin were studied by means of DSC.The apparent activation energy of E-44/PIDA caculated by Kissinger and Ozawa methods were 56.48kJ/mol and 60.76kJ/mol respectively,and the curing reaction order calculated by Crane formula was 0.88.These results show that contrast with DDS,PIDA can reduce the curing temperature and curing time,it can also improve the heat resistance of the composite material because of its low melting point and indane ring structure.The glass transition temperature Tg and initial decomposition temperature Td are 167.8℃ and 361.71℃ respectively.