化学镀Ni-P镀层状态对引线键合的影响(1)

Influence of electroless Ni-P plating condition on wire bondability(1)

观测了化学镀Ni/Au工艺中化学镀Ni-P镀层的状态,评估了基底化学镀Ni-P镀层的P含量和Ni析出状态对引线键合性的影响。

In this paper,electroless Ni-P plating condition in electroless Au/Ni process was observed,and influence of P content and Ni deposits condition of electroless Ni-P plating sued as under layer on wire bondability was evaluated.